Printed Circuit Board Capabilities
| Materials | |
| 01. | FR-4 Tg 140 degree |
| 02. | FR-4 High Tg 160 degree |
| 03. | FR-4 High Tg 180 degree |
| 04. | Modified Epoxies Material |
| 05. | Polyimide |
| 06. | Cyanate Ester (Low dk/Low Loss) |
| 07. | PTFE or equivalents |
| 08. | Alternative HDI Dielectrics |
| 09. | Halogen Free Material |
| 10. | Rogers 4350 |
| 11. | Getek |
| 12. | Nelco 6000 |
| 13. | BT |
| 14. | Taconic |
| 15. | Rogers 4K Series |
| 16. | Rogers 3010 |
| 17. | Risholite |
| 18. | GIL |
Capability Areas
• Layer structures: single-sided, double-sided and multilayer boards.
• Advanced vias: blind and buried vias, laser-drilled microvias and via-fill options where required by the design.
• Materials: FR-4/high-Tg, polyimide, PTFE/low-loss materials, Rogers laminates, aluminium/metal-core and other specialist systems listed above.
• Signal integrity: controlled-impedance and high-frequency constructions.
• Surface finishes: HASL, lead-free HASL, ENIG, OSP, immersion silver, immersion tin and gold finishes as applicable.
• Assembly support: component sourcing, SMT, through-hole, mixed technology, inspection and testing through the PCB assembly service.