|
Finish
|
Description
|
| HASL (Hot Air Solder Leveled) |
Solder is deposited on features that are not covered with Solder Mask. Solder Thickness varies from 0.2 to 1.2 mils. This variation is due to board circuit density, aspect ratio. Solder consists of 63%/37% eutectic Tin/lead |
| OSP (Organic Solder ability Preservative) | A transparent organic coating is deposited on features that are not covered with solder mask. |
| ENIG (Electrolyses Nickel/Gold) | Electrolyses nickel and Electrolyses gold is deposited on features that are not covered with Solder Mask. Thickness for Nickel is between 80 to 150 micro inches and Gold thickness is 3-6 micro inches. |
| Gold Flash | Electrolytic nickel-gold deposited on solder able features. Typically 150-200 micro inches of nickel is deposited, and 5-10 micro inches of Hard gold. Gold flash is applied to features after pattern Copper plating. |
| Immersion Silver | Silver is deposited on features not covered with solder mask. Thickness of silver is 4 to 20 micro inches. |
| White Tin | Immersion tin is deposited on features not covered with Solder mask. Thickness is typically 30-40 micro inches. |
| Carbon Ink for Key pad application |
A conductive carbon paste is applied on selective pads for contact purposes, e.g.. Keypads of calculators, etc. |
| Wire Bondable Soft Gold |
Electrolytic soft gold is plated on features that require bondable gold for wire bonding application. Depending on the type of wire bonding used, the thickness of gold varies from 20 to 50 micro inches. Nickel thickness is between 150 to 250 micro inches. |
