Technologies

Technologies Standard Advanced
Minimum Line/Spacing, Internal 3-Mar 3-Mar
Minimum Line/Spacing, External 4-Apr 3-Mar
Minimum Drilled Hole Size 8 6
Aspect Ratio (Thickness to Drill) 10:01 15:01
Anular Ring (Diameter over Drill) 10 8
Anti-pad (Diameter over Drill) 20 16
Plated Hole Tolerance ±3 ±2
Minimum Dielectric Thickness 3 2
Maximum PCB Thickness (inches) 0.2 0.25
Thickness Tolerance (% of Thickness) ±10 ±7
Maximum PCB Dimensions (inches) 16.0 X 22.0 23.0 X 26.0
Fabricated Dimensions – NC Routing ±5 mils ±3 mils
Layer-to-Layer Registration Tolerance ±5 ±3
Solder Mask Clearance, Per Side 2.0 mils 1.5 mils
Blind/Buried Vias (All Types) yes yes
Via Fill (Conductive, Non-Conductive) no yes

 

Inner Layers Standard Advanced
Minimum Core thickness 3  mils 2 mils
Minimum Line width 4 mils 3 mils (H Oz copper)
Minimum Spacing (Air gap) 4 mils 3 mils (H Oz copper)
Minimum pad size Drill size+10 mils Drill Size+7 mils
Minimum Anti Pad (planes) Drill Size+20 mils Drill Size+16 mils

 

Outer Layers Standard Advanced
Max. Finished Thickness 0.2 0.25
Thickness Tolerance 10% 5%
Max. Aspect Ratio 10:01 12:01
Min. Drill Size 10 mils 8 mils
Min. Line width 4 mils 3 mils
Min. Spacing (air gap) 4 mils 3 mils
Min. Solder mask clearance 4 mils 3 mils
Min. solder mask web thickness
(mask between pads)